Last edited by Goltitaxe
Tuesday, July 28, 2020 | History

3 edition of Istfa "93 found in the catalog.

Istfa "93

Proceedings of the 19th International Symposium for Testing and Failure Analysis 15-19 November 1993 Los Angeles, California

by Suzanne E. Hampson

  • 242 Want to read
  • 29 Currently reading

Published by ASM International .
Written in English

    Subjects:
  • Electronic devices & materials,
  • Materials science,
  • Material Science,
  • Microelectronics,
  • Technology & Industrial Arts,
  • Science/Mathematics

  • The Physical Object
    FormatPaperback
    Number of Pages400
    ID Numbers
    Open LibraryOL11109334M
    ISBN 100871704986
    ISBN 109780871704986

    ISTFA '93 - Proceedings of the International Symposium for Testing and Failure Analysis, Suzanne E. Hampson Death Warrant, Very First Biographies - Easy-To-Read Books about 16 Amazing People All Young Learners Should Know about, Scholastic Teaching Resources, Scholastic. Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation.

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Istfa "93 by Suzanne E. Hampson Download PDF EPUB FB2

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Titre: ISTFA, International Symposium for Testing and Failure Analysis et IEE proc. IGBT propulsion drives, London, mai ISTFA'93 Vers: ISTFA'92 Vers: ISTFA'91 Vers: ISTFA' Vers 25 International Symposium for Testing and Failure Analysis (Book and CD ROM) Lien: ISTFA/ISTFAhtm - le 10 mai Publisher: ASM.

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1 ISTFA conference proceedings from the 38th International Symposium for Testing and Failure Analysis: November, Phoenix Convention Center, Phoenix, Arizona, USA. Program Objective.

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43rd International Symposium for Testing and Failure Analysis (November) You may search for particular presentations by typing key words, an author's name, or the title in the box below.

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Proceedings of the International Symposium for Testing and Failure Analysis, held 12thth November,at Meydenbauer Convention Center, Belvue, Washington. These proceedings present in-depth coverage of the latest developments and the most advanced techniques for testing and failure analysis of microelectronic components.There is an Open Access version for this licensed article that can be read free of charge and without license restrictions.

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